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Options
(1)
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HFB
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High
Frequency Burst: Improved burst capability of driver by means
of external buffer capacitors. Recommended if more than 10 pulses with
less than 10 μs spacing are generated.
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HFS
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High
Frequency Switching: External supply of auxiliary driver
voltage (50-350 VDC according to type). Necessary if the specified
“Maximum Operating Frequency” shall be exceeded.(2)
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LP
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Low
Pass: Low pass filter at the control input. Propagation delay
time will be increased by ~50 ns. Jitter + 500 ps. Improved
noise immunity and less critical wiring in high speed
applications. (3)
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ST
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Stage
Tapping: Connectors at the individual stages of
stack in order to utilize single power semiconductors. To achieve fast
rise times also at very low operating voltages (<0.01xVo).
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ISO-25
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25
kV Isolation: Isolation Voltage increased
to 25 kVDC. Housing dimensions may change for some models.
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ISO-40
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40
kV Isolation: Isolation Voltage increased to
40 kVDC. Housing dimensions may change for some
models. Only in connection with option PT-HV.
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ISO-80
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80
kV Isolation: Isolation Voltage increased
to 80 kVDC. Housing dimensions may change for some
models. Only in connection with option PT-HV.
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ISO-120
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120
kV Isolation: Isolation Voltage increased to 120 kVDC.
Housing dimensions may change for some models. Only in connection with
option PT-HV.
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I-PC
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Integrated
Part Components: Integration of small part components
according to customer’s specifications (e.g. buffer
capacitors, snubbers, damping resistors, diodes, opto couplers).(2)
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I-FWD
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Integrated
Free-Wheeling Diode: Built-in parallel diode with
short recovery time. In connection with inductive load only.
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LS-C
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LEMO socket for Control
Connection. Input Z=100Ω. An assembled linkage cable
(1m/3ft) with two plugs
and one socket is included in supply. Improved noise immunity. (3)
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PT-C
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Pigtail
for Control Connection: Flexible leads (l=75
mm) with AMP-Modu plug. Only for switches with pins, which must be
replaced by pigtails in case of any cooling option except option ITC.
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PIN-C
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Pins
for Control Connection: Gold plated pins for printed circuit
board designs (special sockets available). This option is only relevant
for switching modules which have pigtails as standard.
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PT-HV
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Pigtails
for HV Connection: Flexible leads with cable lugs. For
increased creepage. PT-HV is standard for all types with >25 kV
switching voltage. Not recommended in extremely fast circuits.
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ST-HV
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Screw
Terminals for HV Connection: Threaded inserts at the bottom
of module (if not standard). For PCB design. Operation above 25 kV
requires liquid insulation (Galden®/Oil) or potting.
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UL94
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Flame
Retardant Casting Resin: Casting resin according to UL-94-VO.
Minimum order quantity required. (2)
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TH
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Tubular
Housing: Tubular instead of rectangular housing. Adaption to
specific ambient conditions or in case of difficult assembly
situations. (2)
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FC
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Flat
Case: Height of standard plastic housings reduced to 19 / 25
mm. Not in combination with cooling options CF, GCF and DLC.
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ITC
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Increased
Thermal Conductivity: Special moulding process to increase
the thermal conductivity of the module. Pd(max) will be increased by
approx. 20-30%. (2)
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CF
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Non-Isolated
Cooling Fins: Standard sizes in categories I to VII according
to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and
liquid cooling (e.g. Galden® or oil).
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CF-1
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Non-Isolated
Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of
0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air
and liquid cooling (e.g. Galden® or oil).
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CF-X2
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Non-Isolated
Cooling Fins enlarged by x2: Fin area enlarged by factor 2.
Not relevant in connection with liquid cooling.
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CF-X3
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Non-Isolated
Cooling Fins enlarged by x3: Fin area enlarged by factor 3.
Not relevant in connection with liquid cooling and forced air
convection.
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CF-CS
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Non-Isolated
Cooling Fins with customized shape: Individual shape to meet
specific OEM requirements. (2)
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CF-LC
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Non-isolated
Cooling Fins optimized for liquid cooling: Double fins,
nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced
convection recommended.
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CF-GRA
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Non-isolated Cooling Fins
made of graphite. Very light weight compared to
copper at similar heat
transfer, but reduced heat capacity. 0.5
or 1 mm thickness, height 35 mm.
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CF-CER
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Isolated Cooling Fins
made of ceramics. Heat transfer
properties similar to alumina. Forced convection recommended, height 35 mm.
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CCS
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Ceramic Cooling
Surface. Top side of switching module made of ceramics. Heat
transfer properties similar to alumina. 20 kVDC isolation. Forced
convection recommended.
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C-DR
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Cooling for Driver:
Extra cooling for the driver and control
electronics. Recommended in combination with option HFS at higher
switching frequencies. (2)
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GCF
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Grounded
Cooling Flange: Nickel-plated copper flange for High Power
applications. Max. isolation voltage 40kV. Increased coupling
capacitance. In combination with option SPT-C only.
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GCF-X2
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Grounded
Cooling Flange, Max. Continuous Power Dissipation increased by x2:
Thermal resistance “Switch to Flange” reduced for
twice the power capability. (2)
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ILC
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Indirect Liquid
Cooling: Liquid cooling for all kind of conductive coolants
incl. water. Internal heat exchanger made of ceramics. For
medium power dissipation.
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DLC
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Direct Liquid Cooling: Internal
cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications.
Non-conductive coolants only.
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HI-REL
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High
Reliability / MIL Versions: Available on request.
(2)
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(1)
New option code: Data sheets may differ from this coding
system (especially older ones) and do not indicate all possible options
as per above table. (2) Please consult
factory for detailed information.
(3) These options are EMC-relevant and are recommended for industrial
power applications, difficult noise ambient,
prototype experiments with flying leads and for users without special
EMC design experience.
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