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Option(1)
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Description
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HFB
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High Frequency Burst: Improved burst capability
of driver by means of external buffer
capacitors. Recommended if more than
10 pulses with less than 10 ¥ìs spacing
are generated.
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HFS
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High Frequency Switching: External supply of auxiliary
driver voltage (50-350 VDC according
to type). Necessary if the specified
¡°Maximum Operating Frequency¡± shall
be exceeded. (2)
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LP
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Low Pass: Low pass filter
at the control input. Propagation delay
time will be increased by ~50 ns. Jitter
+ 500 ps. Improved noise immunity
and less critical wiring in high
speed applications. (3)
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S-TT
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Soft Transition Time: ¡±Turn-On Rise Time¡± &
¡°Turn-Off Rise Time¡± increased by ~20%.
Simplified EMC design and less critical
wiring if the shortest possible edge
steepness is not required. (3)
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LNC
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Low Natural Capacitance: CN reduced by
approximately 30%. To minimize capacitive
power losses in applications with high
switching frequency and high switching
voltage (Pc= V2 x C x f).
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LL
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Low Leakage Current: Off-state current reduced
to less than 10% of the specified
value. Not available in connection with
the cooling fin options and for switches
of the UF series.
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LN
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Low Noise: Internal power driver modified for zero noise
emission for a specific period of time.
Relevant in conjunction with extremely
sensitive detector amplifiers (e.g.
SEV/MCP applications) only. (2)
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ISO-25
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25 kV Isolation: Isolation Voltage increased to
25 kVDC. Housing dimensions may change
for some models.
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ISO-40
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40 kV Isolation: Isolation Voltage increased to
40 kVDC. Housing dimensions may change
for some models. Only in connection
with option PT-HV.
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ISO-80
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80 kV Isolation: Isolation Voltage increased to
80 kVDC. Housing dimensions may change
for some models. Only in connection
with option PT-HV.
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ISO-120
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120 kV Isolation: Isolation Voltage increased
to 120 kVDC. Housing dimensions may
change for some models. Only in connection
with option PT-HV.
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I-PC
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Integrated Part Components: Integration of small part
components according to customer¡¯s specifications
(e.g. buffer capacitors, snubbers, damping
resistors, diodes, opto couplers). (2)
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I-FWD
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Integrated Free-Wheeling Diode: Built-in parallel
diode with short recovery time. In connection
with inductive load only.
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I-FWDN
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Integrated Free-Wheeling Diode Network: Built-in parallel
diode plus serial blocking diode
with short recovery time. In connection
with inductive load only.
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SPT-C
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Shielded Pigtail for Control Connection: Cable (l=300mm,
Z=100¥Ø) with LEMO plug+socket and 100¥Ø
termination. Improved noise immunity
in case of long distance to driver circuits.
(3)(4)
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PT-C
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Pigtail for Control Connection: Flexible leads (l=75 mm)
with PCB connector. This option is only
relevant for switching modules with
pins. Recommended for modules with options
CF & GCF.
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PIN-C
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Pins for Control Connection: Gold plated pins for printed
circuit board designs (special sockets
available). This option is only relevant
for switching modules which have pigtails
as standard.
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PT-HV
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Pigtails for HV Connection: Flexible leads with cable
lugs. For increased creepage. PT-HV
is standard for all types with >25
kV switching voltage. Not recommended
in extremely fast circuits.
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ST-HV
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Screw Terminals for HV Connection: Threaded inserts
at the bottom of module (if not standard).
For PCB design. Operation above 25 kV
requires liquid insulation (Galden¢ç/Oil)
or potting.
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ITC
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Increased Thermal Conductivity: Special moulding process
to increase the thermal conductivity
of the module. Pd(max) will
be increased by approx. 20-30%. (2)
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UL94
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Flame Retardant Casting Resin: Casting resin according
to UL-94-VO. Minimum order quantity
required. (2)
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TH
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Tubular Housing: Tubular instead of rectangular housing. Adaption
to specific ambient conditions or in
case of difficult assembly situations.
(2)
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FC
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Flat Case: Height of standard plastic housings reduced to
19 mm or less. Not in combination with
cooling options CF, GCF, DLC and HPMC.
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CF
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Non-Isolated Cooling Fins: Standard sizes in categories
I to VII according to model. Nickel
plated copper 0.5 mm, fin height 35
mm. For air and liquid cooling (e.g.
Galden¢ç or oil).
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CF-1
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Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0
mm instead of 0.5 mm. The Max. Power
Dissipation will be increased by ~80
%. For air and liquid cooling (e.g.
Galden¢ç or oil).
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CF-X2
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Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged
by factor 2. Not relevant in connection
with liquid cooling.
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CF-X3
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Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged
by factor 3. Not relevant in connection
with liquid cooling and forced air convection.
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CF-CS
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Non-Isolated Cooling Fins with customized shape: Individual shape
to meet specific OEM requirements. (2)
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CF-LC
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Non-isolated Cooling Fins optimized for liquid cooling: Double fins,
nickel plated copper, 0.5 mm thickness,
height 20 mm.
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CF-DR
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Cooling Fin for Driver: Small extra cooling fin
for the control electronics. On ground
potential. Can be necessary in combination
with HFS. (2)
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GCF
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Grounded Cooling Flange: Nickel-plated copper flange
for High Power applications. Max. isolation
voltage 40kV. Increased coupling capacitance
CC. In combination with option
SPT-C only.
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GCF-X2
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Grounded Cooling Flange, Max. Continuous Power Dissipation increased
by x2: Thermal resistance ¡°Switch to Flange¡± reduced
for twice the power capability. (2)
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GCF-W
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Water Cooler for Grounded Cooling Flange: Flat water
cooling plate attached to the grounded
cooling flange GCF. With water inlet
and outlet.
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DLC
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Direct Liquid Cooling: Internal liquid channel
in direct contact with the power semiconductors.
Very compact cooling solution for medium
power. Galden¢ç and non-conductive liquids
only. (2)
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HPMC
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High Power Metal Case: Potential free & hermetically
sealed metal housing filled with Galden¢ç.
Available both with heat sink flange
or with secondary water coolant circulation.
From I/2002. (2)
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HI-REL
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High Reliability / MIL Versions: Available on request.
(2)
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(1) New option code: Data sheets may differ from this
coding system (especially older ones)
and do not indicate all possible options
as per above table.
(2) Please consult factory for detailed
information.
(3) These options are EMC-relevant and
are recommended for industrial power
applications, difficult noise
ambients, prototype experiments
with flying leads and for users without
special EMC design experience.
(4) This option is not available in
connection with Sync. I/O for parallel
connection. Please consult factory for
detailed information.
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Further technical information, detailed data sheets and mechanical
drawings are available on request. All
data and specifications subject to change
without notice.
March
2006
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