| LEM | Power
One | Behlke | Data
Mars |
| - Current
Depending On-Time, SCR |
- Fixed
On-Time, General Purpose, MOSFET |
| - Fixed On-Time,
High di/dt, MOSFET |
- Fixed On-Time,
High di/dt, Ultra Fast, MOSFET |
| - Fixed
On-Time, Low Resistance, MOSFET |
- Variable
On-Time, General Purpose, MOSFET |
| - Variable
On-Time, High di/dt, MOSFET |
- Variable
On-Time, Low Coupling Capacitance, MOSFET |
| - Variable
On-Time, Low On-Resistance, MOSFET |
- Variable
On-Time, AC Voltage, MOSFET |
| - Variable
On-Time, General Purpose, IGBT |
- Variable
On-Time, Thyristor / MCT |
| - Variable
On-Time, Push-Pull, MOSFET |
- Laboratory
Pulser & OEM Pulser Units |
| - Fast
Recovery High Voltage Diode Assemblies |
- Passive
Part Components & Accessories |
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| Laboratory
Pulser & OEM Pulser Units |
|
= Ready for use = No external components required = All pulsers optimized
for system integration
=
Laboratory instruments with CE
marking
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Model [sorted by
housing dimensions]
|
Description / Comment
l Preferred stock
type ¢®
Limited stock X Not recommended
for new development
|
Dimensions
[mm3]
|
Voltage
[kV]
|
Pk. Current
[A]
|
HV Pulse Width
[ns]
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GHTS-Series:
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Very compact push-pull switching units for general purpose.
Polarity reversal by grounding plug
.
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GHTS
60
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l
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170 x 110 x 45
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2 x 6
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2 x 15
|
100¡¦¡Ä
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GHTS
30
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l
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170 x 110 x 45
|
2 x 3
|
2 x 30
|
100¡¦¡Ä
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GHTS
30 A
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l
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170 x 110 x 45
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2 x 3
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2 x 60
|
100¡¦¡Ä
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GHTS
100
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l
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210 x 110 x 45
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2 x 10
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2 x 15
|
100¡¦¡Ä
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GHTS
60 A
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l
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210 x 110 x 45
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2 x 6
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2 x 30
|
100¡¦¡Ä
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GHTS
100 A
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l
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210 x 110 x 45
|
2 x 10
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2 x 30
|
100¡¦¡Ä
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GHTS
60 B
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l
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210 x 110 x 45
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2 x 6
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2 x 60
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100¡¦¡Ä
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FHPP-Series:
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Precision push-pull pulsers with remotely controllable polarity
reversal. Fast settling time, low
ringing and low ripple. Ideal for
mass spectrometry etc. Two outputs
with high and low impedance (200 /
50 W)
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FHPP 60
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l
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184 x 105 x 92
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2 x 6
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2 x 80
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60¡¦¡Ä
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FHPP 80
|
l
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184 x 105 x 92
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2 x 8
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2 x 60
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60¡¦¡Ä
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FHPP 100
|
l
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184 x 105 x 92
|
2 x 10
|
2 x 50
|
60¡¦¡Ä
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FHPP 120
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On request
|
184 x 105 x 92
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2 x 12
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2 x 30
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60¡¦¡Ä
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Option(1)
|
Description
|
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Option 01
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Protective Series Resistor 200 Ohm. Only for
model series GHTS.
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Option 02
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Built-in Miniature Fan. Only for model series GHTS.
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Option GCF
|
Grounded Cooling Flange: Cooling by a grounded
base plate made of nickel plated copper.
Only for model series FHPP.
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Model [sorted by
housing dimensions]
|
Description / Comment
l Preferred stock
type ¢®
Limited stock X Not recommended
for new development
|
Dimensions
[mm3]
|
Voltage
[kV]
|
Pk. Current
[A]
|
HV Pulse Width
|
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FQD-Series:
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Fast Solid-State On-Q-Switch Driver. Very compact design for
placement directly at the pockels
cell. Available with cooling options
CF, GCF, GCF-W and DLC for high frequency
/ high power dissipation.
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Depends on R x C
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FQD 40-03
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l
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Based on HTS 40-03, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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4
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35
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100 ns¡¦1 ms
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FQD 40-06
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l
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Based on HTS 40-06, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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4
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60
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100 ns¡¦1 ms
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FQD 50-02
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l
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Based on HTS 50-02, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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5
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25
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100 ns¡¦1 ms
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FQD 50-05
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l
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Based on HTS 50-05, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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5
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50
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100 ns¡¦1 ms
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FQD 60-02
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l
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Based on HTS 60-02, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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6
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20
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100 ns¡¦1 ms
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FQD 60-04
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l
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Based on HTS 60-04, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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6
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40
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100 ns¡¦1 ms
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FQD 80-01
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l
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Based on HTS 80-01, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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8
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15
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100 ns¡¦1 ms
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FQD 80-03
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l
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Based on HTS 80-03, with 200 mm long pigtails for direct pockels
cell connection
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79.5 x 38 x 25
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8
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30
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100 ns¡¦1 ms
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FQD 30-08-UF
|
l
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Based on HTS 30-08-UF, with 200 mm long pigtails for direct
pockels cell connection, ultra fast
|
79.5 x 38 x 25
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3
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80
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100 ns¡¦1 ms
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FQD 30-06-UF
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l
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Based on HTS 30-06-UF, with 200 mm long pigtails for direct
pockels cell connection, ultra fast
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79.5 x 38 x 25
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3.6
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60
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100 ns¡¦1 ms
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DSM-Series:
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Universal pockels cell pulser with ~3 ns transition time and
variable pulse width from
10 ns–100 ¥ìs. Very compact design
for placement directly at the pockels
cell. Available with cooling options
CF, GCF, GCF-W and DLC for high frequency
/ high power dissipation.
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DSM 31-12
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-
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On request
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3
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10 ns–100 ¥ìs
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DSM 61-12
|
-
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On request
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6
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10 ns–100 ¥ìs
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DSM 91-12
|
-
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On request
|
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9
|
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10 ns–100 ¥ìs
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Option(1)
|
Description
|
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HFB
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High Frequency Burst: Improved burst capability
of driver by means of external buffer
capacitors. Recommended if more than
10 pulses with less than 10 ¥ìs spacing
are generated.
|
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HFS
|
High Frequency Switching: External supply of auxiliary
driver voltage (50-350 VDC according
to type). Necessary if the specified
¡°Maximum Operating Frequency¡± shall
be exceeded. (2)
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LP
|
Low Pass: Low pass filter
at the control input. Propagation
delay time will be increased by ~50
ns. Jitter + 500 ps. Improved
noise immunity and less critical
wiring in high speed applications.
(3)
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I-PC
|
Integrated Part Components: Integration of small part
components according to customer¡¯s
specifications (e.g. buffer capacitors,
snubbers, damping resistors, diodes,
opto couplers). (2)
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SPT-C
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Shielded Pigtail for Control Connection: Cable (l=300mm,
Z=100¥Ø) with LEMO plug+socket and
100¥Ø termination. Improved noise immunity
in case of long distance to driver
circuits. (3)(4)
|
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PT-C
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Pigtail for Control Connection: Flexible leads (l=75 mm)
with PCB connector. This option is
only relevant for switching modules
with pins. Recommended for modules
with options CF & GCF.
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PIN-C
|
Pins for Control Connection: Gold plated pins for printed
circuit board designs (special sockets
available). This option is only relevant
for switching modules which have pigtails
as standard.
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PT-HV
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Pigtails for HV Connection: Flexible leads with cable
lugs. For increased creepage. PT-HV
is standard for all types with >25
kV switching voltage. Not recommended
in extremely fast circuits.
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ST-HV
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Screw Terminals for HV Connection: Threaded inserts
at the bottom of module (if not standard).
For PCB design. Operation above 25
kV requires liquid insulation (Galden¢ç/Oil)
or potting.
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UL94
|
Flame Retardant Casting Resin: Casting resin according
to UL-94-VO. Minimum order quantity
required. (2)
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FC
|
Flat Case: Height of standard plastic housings reduced to
19 mm or less. Not in combination
with cooling options CF, GCF, DLC
and HPMC.
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CF
|
Non-Isolated Cooling Fins: Standard sizes in categories
I to VII according to model. Nickel
plated copper 0.5 mm, fin height 35
mm. For air and liquid cooling (e.g.
Galden¢ç or oil).
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CF-1
|
Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0
mm instead of 0.5 mm. The Max. Power
Dissipation will be increased by ~80
%. For air and liquid cooling (e.g.
Galden¢ç or oil).
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CF-X2
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Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged
by factor 2. Not relevant in connection
with liquid cooling.
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CF-X3
|
Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged
by factor 3. Not relevant in connection
with liquid cooling and forced air
convection.
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CF-CS
|
Non-Isolated Cooling Fins with customized shape: Individual shape
to meet specific OEM requirements.
(2)
|
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CF-LC
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Non-isolated Cooling Fins optimized for liquid cooling: Double fins,
nickel plated copper, 0.5 mm thickness,
height 20 mm.
|
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CF-DR
|
Cooling Fin for Driver: Small extra cooling fin for
the control electronics. On ground
potential. Can be necessary in combination
with HFS. (2)
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GCF
|
Grounded Cooling Flange: Nickel-plated copper flange
for High Power applications. Max.
isolation voltage 40kV. Increased
coupling capacitance CC.
In combination with option SPT-C only.
|
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GCF-X2
|
Grounded Cooling Flange, Max. Continuous Power Dissipation increased
by x2: Thermal resistance ¡°Switch to Flange¡± reduced
for twice the power capability. (2)
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GCF-W
|
Water Cooler for Grounded Cooling Flange: Flat water
cooling plate attached to the grounded
cooling flange GCF. With water inlet
and outlet.
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DLC
|
Direct Liquid Cooling: Internal liquid channel
in direct contact with the power semiconductors.
Very compact cooling solution for
medium power. Galden¢ç and non-conductive
liquids only. (2)
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HPMC
|
High Power Metal Case: Potential free & hermetically
sealed metal housing filled with Galden¢ç.
Available both with heat sink flange
or with secondary water coolant circulation.
From I/2002. (2)
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HI-REL
|
High Reliability / MIL Versions: Available on request.
(2)
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(1) New option code: Data sheets may differ from this
coding system (especially older ones)
and do not indicate all possible options
as per above table.
(2) Please consult factory for detailed
information.
(3) These options are EMC-relevant
and are recommended for industrial
power applications, difficult
noise ambients, prototype experiments
with flying leads and for users without
special EMC design experience.
(4) This option is not available in
connection with Sync. I/O for parallel
connection. Please consult factory
for detailed information.
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Further technical information, detailed data sheets and mechanical
drawings are available on request.
All data and specifications subject
to change without notice.
October
2007
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