| LEM | Power
One | Behlke | Data
Mars |
| - Current
Depending On-Time, SCR |
- Fixed
On-Time, General Purpose, MOSFET |
| - Fixed On-Time,
High di/dt, MOSFET |
- Fixed On-Time,
High di/dt, Ultra Fast, MOSFET |
| - Fixed
On-Time, Low Resistance, MOSFET |
- Variable
On-Time, General Purpose, MOSFET |
| - Variable
On-Time, High di/dt, MOSFET |
- Variable
On-Time, Low Coupling Capacitance, MOSFET |
| - Variable
On-Time, Low On-Resistance, MOSFET |
- Variable
On-Time, AC Voltage, MOSFET |
| - Variable
On-Time, General Purpose, IGBT |
- Variable
On-Time, Thyristor / MCT |
| - Variable
On-Time, Push-Pull, MOSFET |
- Laboratory
Pulser & OEM Pulser Units |
| - Fast
Recovery High Voltage Diode Assemblies |
- Passive
Part Components & Accessories |
|
|
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| Fast
Recovery High Voltage Diode Assemblies |
|
=
Free wheeling diodes for HTS solid-state
switches in combination with inductive
load = Soft recovery characteristics = High peak current
capability =
Short recovery time
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Model [sorted by
housing dimensions]
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Description / Comment
l Preferred stock
type ¢®
Limited stock X Not recommended
for new development
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Dimensions
[mm3]
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Voltage
[kV]
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Pk. Current
[A]
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FDA 60-180
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l
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Especially for HTS 61-40, HTS 61-240-SI and 61-160-FI
|
78 x 76 x 25
|
6
|
1800
|
|
FDA 60-240
|
l
|
Especially for HTS 61-40, HTS 61-240-SI and 61-160-FI
|
102 x 76 x 25
|
6
|
2400
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FDA
100-75
|
l
|
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84 x 35 x 30
|
10
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750
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FDA
100-150
|
l
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84 x 35 x 30
|
10
|
1500
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FDA
160-75
|
l
|
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84 x 35 x 30
|
16
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750
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FDA
160-150
|
l
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84 x 35 x 30
|
16
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1500
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FDA
200-75
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l
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101 x 35 x 30
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20
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750
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FDA
200-150
|
l
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101 x 35 x 30
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20
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1500
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FDA
240-75
|
l
|
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116 x 35 x 30
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24
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750
|
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FDA
240-150
|
l
|
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116 x 35 x 30
|
24
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1500
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FDA
300-75
|
l
|
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141 x 35 x 30
|
30
|
750
|
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FDA
300-150
|
l
|
|
141 x 35 x 30
|
30
|
1500
|
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FDA
320-75
|
l
|
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152 x 35 x 30
|
32
|
750
|
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FDA
320-150
|
l
|
|
152 x 35 x 30
|
32
|
1500
|
|
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FDA 640-75
|
l
|
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300 x 35 x 35
|
64
|
750
|
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FDA 640-150
|
l
|
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300 x 53 x 53
|
64
|
1500
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FDA 800-75
|
l
|
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400 x 35 x 35
|
80
|
750
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FDA 800-150
|
l
|
|
400 x 53 x 53
|
80
|
1500
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FDA 100-300
|
l
|
|
84 x 70 x 35
|
16
|
3000
|
|
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|
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FDA 160-300
|
l
|
|
103 x 70 x 35
|
16
|
3000
|
|
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FDA 200-300
|
l
|
|
103 x 70 x 35
|
20
|
3000
|
|
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FDA 240-300
|
l
|
|
116 x 70 x 35
|
24
|
3000
|
|
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FDA 320-300
|
l
|
|
152 x 70 x 35
|
32
|
3000
|
|
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FDA 640-300
|
l
|
|
300 x 70 x 35
|
64
|
3000
|
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FDA 800-300
|
l
|
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370 x 70 x 35
|
80
|
3000
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Option(1)
|
Description
|
|
|
|
|
PT-HV
|
Pigtails for HV Connection: Flexible leads with cable
lugs. Not recommended in extremely
fast circuits.
|
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UL94
|
Flame Retardant Casting Resin: Casting resin according to
UL-94-VO. Minimum order quantity required.
(2)
|
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CF
|
Non-Isolated Cooling Fins: Standard sizes in categories
I to VII according to model. Nickel
plated copper 0.5 mm, fin height 35
mm. For air and liquid cooling (e.g.
Galden¢ç or oil).
|
|
CF-1
|
Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0
mm instead of 0.5 mm. The Max. Power
Dissipation will be increased by ~80
%. For air and liquid cooling (e.g.
Galden¢ç or oil).
|
|
CF-X2
|
Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged
by factor 2. Not relevant in connection
with liquid cooling.
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CF-X3
|
Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged
by factor 3. Not relevant in connection
with liquid cooling and forced air
convection.
|
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CF-CS
|
Non-Isolated Cooling Fins with customized shape: Individual shape
to meet specific OEM requirements.
(2)
|
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CF-LC
|
Non-isolated Cooling Fins optimized for liquid cooling: Double fins,
nickel plated copper, 0.5 mm thickness,
height 20 mm.
|
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GCF
|
Grounded Cooling Flange: Cooling by a grounded base
plate made of nickel plated copper.
For high power applications. Increased
coupling capacitance. Isolation voltage
up to 40 kVDC.
|
|
GCF-X2
|
Grounded Cooling Flange, Max. Continuous Power Dissipation increased
by x2: Thermal resistance ¡°Switch to Flange¡± reduced
for twice the power capability. (2)
|
|
GCF-W
|
Water Cooler for Grounded Cooling Flange: Flat water
cooling plate attached to the grounded
cooling flange GCF. With water inlet
and outlet.
|
|
DLC
|
Direct Liquid Cooling: Internal liquid channel
in direct contact with the power semiconductors.
Very compact cooling solution for
medium power. Galden¢ç and non-conductive
liquids only. (2)
|
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HI-REL
|
High Reliability / MIL Versions: Available on request.
(2)
|
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(1) New option code: Data sheets may differ from this
coding system (especially older ones)
and do not indicate all possible options
as per above table.
(2) Please consult factory for detailed
information.
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Further technical information, detailed data sheets and mechanical
drawings are available on request.
All data and specifications subject
to change without notice.
March 2006
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