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Option(1)
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Description
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HFB
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High Frequency Burst: Improved burst capability
of driver by means of external buffer capacitors.
Recommended if more than 10 pulses with less than
10 ¥ìs spacing are generated.
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HFS
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High Frequency Switching: External supply of auxiliary
driver voltage (50-350 VDC according to type). Necessary
if the specified ¡°Maximum Operating Frequency¡± shall
be exceeded. (2)
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LP
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Low Pass: Low pass filter at the control input. Propagation
delay time will be increased by ~50 ns. Jitter +
500 ps. Improved noise immunity and
less critical wiring in high speed applications.
(3)
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S-TT
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Soft Transition Time: ¡±Turn-On Rise Time¡± &
¡°Turn-Off Rise Time¡± increased by ~20%. Simplified
EMC design and less critical wiring if the shortest
possible edge steepness is not required. (3)
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TT-C
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Customized Transition Time: Customized rise &
fall times to meet individual design requirements.
(2)
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MIN-ON
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Minimum On-Time: Individually increased Minimum On-Time to
ensure a minimum on duration indepently of control
signal. For safety relevant circuits.
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MIN-OFF
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Minimum Off-Time: Individually increased Minimum
Off-Time to ensure a minimum off duration indepently
of control signal. For safety relevant circuits.
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ST
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Stage Tapping: Connectors at the individual stages
of stack in order to utilize single power semiconductors.
To achieve fast rise times also at very low operating
voltages (<0.01xVo).
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LNC
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Low Natural Capacitance: CN reduced by
approximately 30%. To minimize capacitive power
losses in applications with high switching frequency
and high switching voltage (Pc= V2 x
C x f).
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LL
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Low Leakage Current: Off-state current reduced
to less than 10% of the specified value. Not
available in connection with the cooling fin options
and for switches of the UF series.
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LN
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Low Noise: Internal power driver modified for zero noise
emission for a specific period of time. Relevant
in conjunction with extremely sensitive detector
amplifiers (e.g. SEV/MCP applications) only. (2)
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ISO-25
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25 kV Isolation: Isolation Voltage increased to
25 kVDC. Housing dimensions may change for some
models.
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ISO-40
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40 kV Isolation: Isolation Voltage increased to
40 kVDC. Housing dimensions may change for some
models. Only in connection with option PT-HV.
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ISO-80
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80 kV Isolation: Isolation Voltage increased
to 80 kVDC. Housing dimensions may change
for some models. Only in connection with option
PT-HV.
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ISO-120
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120 kV Isolation: Isolation Voltage increased
to 120 kVDC. Housing dimensions may change for some
models. Only in connection with option PT-HV.
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PL
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Passive Lock: Special inhibit function for two single switches
in fast push-pull circuits. The input of the passive
switch will be locked by the activated switch to
avoid turn-on by noise.
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I-PC
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Integrated Part Components: Integration of small part
components according to customer¡¯s specifications
(e.g. buffer capacitors, snubbers, damping resistors,
diodes, opto couplers). (2)
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I-FWD
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Integrated Free-Wheeling Diode: Built-in parallel
diode with short recovery time. In connection with
inductive load only.
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I-FWDN
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Integrated Free-Wheeling Diode Network: Built-in parallel
diode plus serial blocking diode with short
recovery time. In connection with inductive load
only.
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SPT-C
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Shielded Pigtail for Control Connection: Cable (l=300mm,
Z=100¥Ø) with LEMO plug+socket and 100¥Ø termination.
Improved noise immunity in case of long distance
to driver circuits. (3)(4)
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PT-C
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Pigtail for Control Connection: Flexible leads (l=75 mm)
with PCB connector. This option is only relevant
for switching modules with pins. Recommended for
modules with options CF & GCF.
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PIN-C
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Pins for Control Connection: Gold plated pins for printed
circuit board designs (special sockets available).
This option is only relevant for switching modules
which have pigtails as standard.
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PT-HV
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Pigtails for HV Connection: Flexible leads with cable
lugs. For increased creepage. PT-HV is standard
for all types with >25 kV switching voltage.
Not recommended in extremely fast circuits.
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ST-HV
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Screw Terminals for HV Connection: Threaded inserts
at the bottom of module (if not standard). For PCB
design. Operation above 25 kV requires liquid insulation
(Galden¢ç/Oil) or potting.
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UL94
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Flame Retardant Casting Resin: Casting resin according
to UL-94-VO. Minimum order quantity required. (2)
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TH
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Tubular Housing: Tubular instead of rectangular housing. Adaption
to specific ambient conditions or in case
of difficult assembly situations. (2)
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FC
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Flat Case: Height of standard plastic housings reduced to 19
mm or less. Not in combination with cooling options
CF, GCF, DLC and HPMC.
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CF
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Non-Isolated Cooling Fins: Standard sizes in categories
I to VII according to model. Nickel plated copper
0.5 mm, fin height 35 mm. For air and liquid cooling
(e.g. Galden¢ç or oil).
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CF-1
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Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0
mm instead of 0.5 mm. The Max. Power Dissipation
will be increased by ~80 %. For air and liquid cooling
(e.g. Galden¢ç or oil).
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CF-X2
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Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged
by factor 2. Not relevant in connection with liquid
cooling.
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CF-X3
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Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged
by factor 3. Not relevant in connection with liquid
cooling and forced air convection.
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CF-CS
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Non-Isolated Cooling Fins with customized shape: Individual shape
to meet specific OEM requirements. (2)
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CF-LC
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Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel
plated copper, 0.5 mm thickness, height 20 mm.
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CF-DR
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Cooling Fin for Driver: Small extra cooling fin
for the control electronics. On ground potential.
Can be necessary in combination with HFS. (2)
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GCF
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Grounded Cooling Flange: Nickel-plated copper flange
for High Power applications. Max. isolation voltage
40kV. Increased coupling capacitance CC.
In combination with option SPT-C only.
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GCF-X2
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Grounded Cooling Flange, Max. Continuous Power Dissipation increased
by x2: Thermal resistance ¡°Switch to Flange¡± reduced
for twice the power capability. (2)
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GCF-W
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Water Cooler for Grounded Cooling Flange: Flat water
cooling plate attached to the grounded cooling flange
GCF. With water inlet and outlet.
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DLC
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Direct Liquid Cooling: Internal liquid channel
in direct contact with the power semiconductors.
Very compact cooling solution for medium power.
Galden¢ç and non-conductive liquids only. (2)
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HPMC
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High Power Metal Case: Potential free & hermetically
sealed metal housing filled with Galden¢ç. Available
both with heat sink flange or with secondary water
coolant circulation. From I/2002. (2)
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HI-REL
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High Reliability / MIL Versions: Available on request.
(2)
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(1) New option code: Data sheets may differ from this
coding system (especially older ones) and do not
indicate all possible options as per above table.
(2) Please consult factory for detailed information.
(3) These options are EMC-relevant and are recommended
for industrial power applications, difficult
noise ambients, prototype experiments with
flying leads and for users without special EMC design
experience.
(4) This option is not available in connection with
Sync. I/O for parallel connection. Please consult
factory for detailed information.
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Further technical information, detailed data sheets and mechanical
drawings are available on request. All data and
specifications subject to change without notice.
March
2006
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